CHERNOV, Ivan E.; KONDAKOV, Nikita A.; PEREDERIN, Konstantin D.; VLASOV, Andrey I.; ZHALNIN, Vladimir P.; SHAKHNOV, Vadim A. Use of the “Via-In-Pad” Method to Ensure the High-Density Layout of the Conductive Pattern when Designing Multilayer Switching Structures. International Journal on Advanced Science, Engineering and Information Technology, [S. l.], v. 10, n. 3, p. 1176–1183, 2020. DOI: 10.18517/ijaseit.10.3.10831. Disponível em: http://ijaseit.insightsociety.org/index.php/ijaseit/article/view/10831. Acesso em: 3 jun. 2024.