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A Feature Extractor IC for Acoustic Emission Non-destructive Testing

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@article{IJASEIT8281,
   author = {Daniele Giardino and Marco Matta and Sergio Spanò},
   title = {A Feature Extractor IC for Acoustic Emission Non-destructive Testing},
   journal = {International Journal on Advanced Science, Engineering and Information Technology},
   volume = {9},
   number = {2},
   year = {2019},
   pages = {538--543},
   keywords = {IoT; acoustic emission; non-destructive testing; DSP; ASIC.},
   abstract = {

In this paper, we present the design and the implementation of a digital Application Specific Integrated Circuit (ASIC) for Acoustic Emission (AE) non-destructive testing. The AE non-destructive testing method is a diagnostic method used to detect faults in mechanically loaded structures and components. If a structure is subjected to mechanical load or stress, the presence of structural discontinuities releases energy in the form of acoustic emissions through the constituting material. The analysis of these acoustic emissions can be used to determine the presence of faults in several structures. The proposed circuit has been designed for IoT (Internet of Things) applications, and it can be used to simplify the existing procedures adopted for structural integrity verifications of pressurized metal tanks that, in some countries, they are based on periodic checks. The proposed ASIC is provided of Digital Signal Processing (DSP) capabilities for the extraction of the main four parameters used in the AE analysis that are the energy of the signal, the duration of the event, the number of the crossing of a certain threshold and finally the maximum value reached by the AE signal. The circuit is provided of an SPI interface capable of sending and receiving data to/from wireless transceivers to share information on the web. The DSP circuit has been coded in VHDL and synthesized in 90 nm technology using Synopsys. The circuit has been characterized in terms of area, speed, and power consumption. Experimental results show that the proposed circuit presents very low power consumption properties and low area requirements.

},    issn = {2088-5334},    publisher = {INSIGHT - Indonesian Society for Knowledge and Human Development},    url = {http://ijaseit.insightsociety.org/index.php?option=com_content&view=article&id=9&Itemid=1&article_id=8281},    doi = {10.18517/ijaseit.9.2.8281} }

EndNote

%A Giardino, Daniele
%A Matta, Marco
%A Spanò, Sergio
%D 2019
%T A Feature Extractor IC for Acoustic Emission Non-destructive Testing
%B 2019
%9 IoT; acoustic emission; non-destructive testing; DSP; ASIC.
%! A Feature Extractor IC for Acoustic Emission Non-destructive Testing
%K IoT; acoustic emission; non-destructive testing; DSP; ASIC.
%X 

In this paper, we present the design and the implementation of a digital Application Specific Integrated Circuit (ASIC) for Acoustic Emission (AE) non-destructive testing. The AE non-destructive testing method is a diagnostic method used to detect faults in mechanically loaded structures and components. If a structure is subjected to mechanical load or stress, the presence of structural discontinuities releases energy in the form of acoustic emissions through the constituting material. The analysis of these acoustic emissions can be used to determine the presence of faults in several structures. The proposed circuit has been designed for IoT (Internet of Things) applications, and it can be used to simplify the existing procedures adopted for structural integrity verifications of pressurized metal tanks that, in some countries, they are based on periodic checks. The proposed ASIC is provided of Digital Signal Processing (DSP) capabilities for the extraction of the main four parameters used in the AE analysis that are the energy of the signal, the duration of the event, the number of the crossing of a certain threshold and finally the maximum value reached by the AE signal. The circuit is provided of an SPI interface capable of sending and receiving data to/from wireless transceivers to share information on the web. The DSP circuit has been coded in VHDL and synthesized in 90 nm technology using Synopsys. The circuit has been characterized in terms of area, speed, and power consumption. Experimental results show that the proposed circuit presents very low power consumption properties and low area requirements.

%U http://ijaseit.insightsociety.org/index.php?option=com_content&view=article&id=9&Itemid=1&article_id=8281 %R doi:10.18517/ijaseit.9.2.8281 %J International Journal on Advanced Science, Engineering and Information Technology %V 9 %N 2 %@ 2088-5334

IEEE

Daniele Giardino,Marco Matta and Sergio Spanò,"A Feature Extractor IC for Acoustic Emission Non-destructive Testing," International Journal on Advanced Science, Engineering and Information Technology, vol. 9, no. 2, pp. 538-543, 2019. [Online]. Available: http://dx.doi.org/10.18517/ijaseit.9.2.8281.

RefMan/ProCite (RIS)

TY  - JOUR
AU  - Giardino, Daniele
AU  - Matta, Marco
AU  - Spanò, Sergio
PY  - 2019
TI  - A Feature Extractor IC for Acoustic Emission Non-destructive Testing
JF  - International Journal on Advanced Science, Engineering and Information Technology; Vol. 9 (2019) No. 2
Y2  - 2019
SP  - 538
EP  - 543
SN  - 2088-5334
PB  - INSIGHT - Indonesian Society for Knowledge and Human Development
KW  - IoT; acoustic emission; non-destructive testing; DSP; ASIC.
N2  - 

In this paper, we present the design and the implementation of a digital Application Specific Integrated Circuit (ASIC) for Acoustic Emission (AE) non-destructive testing. The AE non-destructive testing method is a diagnostic method used to detect faults in mechanically loaded structures and components. If a structure is subjected to mechanical load or stress, the presence of structural discontinuities releases energy in the form of acoustic emissions through the constituting material. The analysis of these acoustic emissions can be used to determine the presence of faults in several structures. The proposed circuit has been designed for IoT (Internet of Things) applications, and it can be used to simplify the existing procedures adopted for structural integrity verifications of pressurized metal tanks that, in some countries, they are based on periodic checks. The proposed ASIC is provided of Digital Signal Processing (DSP) capabilities for the extraction of the main four parameters used in the AE analysis that are the energy of the signal, the duration of the event, the number of the crossing of a certain threshold and finally the maximum value reached by the AE signal. The circuit is provided of an SPI interface capable of sending and receiving data to/from wireless transceivers to share information on the web. The DSP circuit has been coded in VHDL and synthesized in 90 nm technology using Synopsys. The circuit has been characterized in terms of area, speed, and power consumption. Experimental results show that the proposed circuit presents very low power consumption properties and low area requirements.

UR - http://ijaseit.insightsociety.org/index.php?option=com_content&view=article&id=9&Itemid=1&article_id=8281 DO - 10.18517/ijaseit.9.2.8281

RefWorks

RT Journal Article
ID 8281
A1 Giardino, Daniele
A1 Matta, Marco
A1 Spanò, Sergio
T1 A Feature Extractor IC for Acoustic Emission Non-destructive Testing
JF International Journal on Advanced Science, Engineering and Information Technology
VO 9
IS 2
YR 2019
SP 538
OP 543
SN 2088-5334
PB INSIGHT - Indonesian Society for Knowledge and Human Development
K1 IoT; acoustic emission; non-destructive testing; DSP; ASIC.
AB 

In this paper, we present the design and the implementation of a digital Application Specific Integrated Circuit (ASIC) for Acoustic Emission (AE) non-destructive testing. The AE non-destructive testing method is a diagnostic method used to detect faults in mechanically loaded structures and components. If a structure is subjected to mechanical load or stress, the presence of structural discontinuities releases energy in the form of acoustic emissions through the constituting material. The analysis of these acoustic emissions can be used to determine the presence of faults in several structures. The proposed circuit has been designed for IoT (Internet of Things) applications, and it can be used to simplify the existing procedures adopted for structural integrity verifications of pressurized metal tanks that, in some countries, they are based on periodic checks. The proposed ASIC is provided of Digital Signal Processing (DSP) capabilities for the extraction of the main four parameters used in the AE analysis that are the energy of the signal, the duration of the event, the number of the crossing of a certain threshold and finally the maximum value reached by the AE signal. The circuit is provided of an SPI interface capable of sending and receiving data to/from wireless transceivers to share information on the web. The DSP circuit has been coded in VHDL and synthesized in 90 nm technology using Synopsys. The circuit has been characterized in terms of area, speed, and power consumption. Experimental results show that the proposed circuit presents very low power consumption properties and low area requirements.

LK http://ijaseit.insightsociety.org/index.php?option=com_content&view=article&id=9&Itemid=1&article_id=8281 DO - 10.18517/ijaseit.9.2.8281