Chernov, I.E. et al. 2020. Use of the “Via-In-Pad” Method to Ensure the High-Density Layout of the Conductive Pattern when Designing Multilayer Switching Structures. International Journal on Advanced Science, Engineering and Information Technology. 10, 3 (Jun. 2020), 1176–1183. DOI:https://doi.org/10.18517/ijaseit.10.3.10831.