DOI : https://doi.org/10.18517/ijaseit.6.4.903

The Effect of Carbon Nanotube Loading on Wettability of Solder Paste SAC 237 and Different Substrates

Norazwani Muhammad Zain (1), Nasrizal Mohd Rashdi (2), Nik Khairul Amilin Nik Ubaidillah (3), Muhammad Syahin Azmi (4)
(1) Fabrication & Joining Section, Universiti Kuala Lumpur Malaysia France Institute, Bandar Baru Bangi, Selangor, MALAYSIA.
(2) Fabrication & Joining Section, Universiti Kuala Lumpur Malaysia France Institute, Bandar Baru Bangi, Selangor, MALAYSIA.
(3) Fabrication & Joining Section, Universiti Kuala Lumpur Malaysia France Institute, Bandar Baru Bangi, Selangor, MALAYSIA.
(4) Fabrication & Joining Section, Universiti Kuala Lumpur Malaysia France Institute, Bandar Baru Bangi, Selangor, MALAYSIA.
Fulltext View | Download
How to cite (IJASEIT) :
Muhammad Zain, Norazwani, et al. “The Effect of Carbon Nanotube Loading on Wettability of Solder Paste SAC 237 and Different Substrates”. International Journal on Advanced Science, Engineering and Information Technology, vol. 6, no. 4, Aug. 2016, pp. 540-3, doi:10.18517/ijaseit.6.4.903.
Citation Format :
Wettability of Pb-free soldered surface is one of the main solderability classifications. The aim of this study is to investigate the effect of various percentages of carbon nanotube (CNT) loading (0 - 4%) on the wettability of solder paste SAC 237 and different substrates namely copper (Cu) and tin (Sn). The influence of surface roughness on the wetting behaviour was also studied. Both substrates were undergone a mechanical abrasion process by using four different grit sizes (P240 , P400, P600 and P800) before performing the reflow soldering process using a reflow oven at a temperature of 180°C for 13 minutes. The surface roughness of the substrates was characterized by using a profilometer. Meanwhile, wettability tests were performed by using the optical microscope. Both substrates have shown similar behaviour; the rougher surface gives better wettability compared to the smoother one. The wettability of SAC 237 is not significantly affected by the addition of various percentages of CNT. However, CNT loading in the solder paste has shown the different wetting behaviour for both substrates.

Authors who publish with this journal agree to the following terms:

    1. Authors retain copyright and grant the journal right of first publication with the work simultaneously licensed under a Creative Commons Attribution License that allows others to share the work with an acknowledgement of the work's authorship and initial publication in this journal.
    2. Authors are able to enter into separate, additional contractual arrangements for the non-exclusive distribution of the journal's published version of the work (e.g., post it to an institutional repository or publish it in a book), with an acknowledgement of its initial publication in this journal.
    3. Authors are permitted and encouraged to post their work online (e.g., in institutional repositories or on their website) prior to and during the submission process, as it can lead to productive exchanges, as well as earlier and greater citation of published work (See The Effect of Open Access).