Cite Article

The Effect of Carbon Nanotube Loading on Wettability of Solder Paste SAC 237 and Different Substrates

Choose citation format

BibTeX

@article{IJASEIT903,
   author = {Norazwani Muhammad Zain and Nasrizal Mohd Rashdi and Nik Khairul Amilin Nik Ubaidillah and Muhammad Syahin Azmi},
   title = {The Effect of Carbon Nanotube Loading on Wettability of Solder Paste SAC 237 and Different Substrates},
   journal = {International Journal on Advanced Science, Engineering and Information Technology},
   volume = {6},
   number = {4},
   year = {2016},
   pages = {540--543},
   keywords = {reflow soldering; wettability; carbon nanotube; surface roughness},
   abstract = {Wettability of Pb-free soldered surface is one of the main solderability classifications. The aim of this study is to investigate the effect of various percentages of carbon nanotube (CNT) loading (0 – 4%) on the wettability of solder paste SAC 237 and different substrates namely copper (Cu) and tin (Sn). The influence of surface roughness on the wetting behaviour was also studied. Both substrates were undergone a mechanical abrasion process by using four different grit sizes (P240 , P400, P600 and P800) before performing the reflow soldering process using a reflow oven at a temperature of 180°C for 13 minutes. The surface roughness of the substrates was characterized by using a profilometer. Meanwhile, wettability tests were performed by using the optical microscope. Both substrates have shown similar behaviour; the rougher surface gives better wettability compared to the smoother one. The wettability of SAC 237 is not significantly affected by the addition of various percentages of CNT. However, CNT loading in the solder paste has shown the different wetting behaviour for both substrates.},
   issn = {2088-5334},
   publisher = {INSIGHT - Indonesian Society for Knowledge and Human Development},
   url = {http://ijaseit.insightsociety.org/index.php?option=com_content&view=article&id=9&Itemid=1&article_id=903},
   doi = {10.18517/ijaseit.6.4.903}
}

EndNote

%A Muhammad Zain, Norazwani
%A Mohd Rashdi, Nasrizal
%A Nik Ubaidillah, Nik Khairul Amilin
%A Syahin Azmi, Muhammad
%D 2016
%T The Effect of Carbon Nanotube Loading on Wettability of Solder Paste SAC 237 and Different Substrates
%B 2016
%9 reflow soldering; wettability; carbon nanotube; surface roughness
%! The Effect of Carbon Nanotube Loading on Wettability of Solder Paste SAC 237 and Different Substrates
%K reflow soldering; wettability; carbon nanotube; surface roughness
%X Wettability of Pb-free soldered surface is one of the main solderability classifications. The aim of this study is to investigate the effect of various percentages of carbon nanotube (CNT) loading (0 – 4%) on the wettability of solder paste SAC 237 and different substrates namely copper (Cu) and tin (Sn). The influence of surface roughness on the wetting behaviour was also studied. Both substrates were undergone a mechanical abrasion process by using four different grit sizes (P240 , P400, P600 and P800) before performing the reflow soldering process using a reflow oven at a temperature of 180°C for 13 minutes. The surface roughness of the substrates was characterized by using a profilometer. Meanwhile, wettability tests were performed by using the optical microscope. Both substrates have shown similar behaviour; the rougher surface gives better wettability compared to the smoother one. The wettability of SAC 237 is not significantly affected by the addition of various percentages of CNT. However, CNT loading in the solder paste has shown the different wetting behaviour for both substrates.
%U http://ijaseit.insightsociety.org/index.php?option=com_content&view=article&id=9&Itemid=1&article_id=903
%R doi:10.18517/ijaseit.6.4.903
%J International Journal on Advanced Science, Engineering and Information Technology
%V 6
%N 4
%@ 2088-5334

IEEE

Norazwani Muhammad Zain,Nasrizal Mohd Rashdi,Nik Khairul Amilin Nik Ubaidillah and Muhammad Syahin Azmi,"The Effect of Carbon Nanotube Loading on Wettability of Solder Paste SAC 237 and Different Substrates," International Journal on Advanced Science, Engineering and Information Technology, vol. 6, no. 4, pp. 540-543, 2016. [Online]. Available: http://dx.doi.org/10.18517/ijaseit.6.4.903.

RefMan/ProCite (RIS)

TY  - JOUR
AU  - Muhammad Zain, Norazwani
AU  - Mohd Rashdi, Nasrizal
AU  - Nik Ubaidillah, Nik Khairul Amilin
AU  - Syahin Azmi, Muhammad
PY  - 2016
TI  - The Effect of Carbon Nanotube Loading on Wettability of Solder Paste SAC 237 and Different Substrates
JF  - International Journal on Advanced Science, Engineering and Information Technology; Vol. 6 (2016) No. 4
Y2  - 2016
SP  - 540
EP  - 543
SN  - 2088-5334
PB  - INSIGHT - Indonesian Society for Knowledge and Human Development
KW  - reflow soldering; wettability; carbon nanotube; surface roughness
N2  - Wettability of Pb-free soldered surface is one of the main solderability classifications. The aim of this study is to investigate the effect of various percentages of carbon nanotube (CNT) loading (0 – 4%) on the wettability of solder paste SAC 237 and different substrates namely copper (Cu) and tin (Sn). The influence of surface roughness on the wetting behaviour was also studied. Both substrates were undergone a mechanical abrasion process by using four different grit sizes (P240 , P400, P600 and P800) before performing the reflow soldering process using a reflow oven at a temperature of 180°C for 13 minutes. The surface roughness of the substrates was characterized by using a profilometer. Meanwhile, wettability tests were performed by using the optical microscope. Both substrates have shown similar behaviour; the rougher surface gives better wettability compared to the smoother one. The wettability of SAC 237 is not significantly affected by the addition of various percentages of CNT. However, CNT loading in the solder paste has shown the different wetting behaviour for both substrates.
UR  - http://ijaseit.insightsociety.org/index.php?option=com_content&view=article&id=9&Itemid=1&article_id=903
DO  - 10.18517/ijaseit.6.4.903

RefWorks

RT Journal Article
ID 903
A1 Muhammad Zain, Norazwani
A1 Mohd Rashdi, Nasrizal
A1 Nik Ubaidillah, Nik Khairul Amilin
A1 Syahin Azmi, Muhammad
T1 The Effect of Carbon Nanotube Loading on Wettability of Solder Paste SAC 237 and Different Substrates
JF International Journal on Advanced Science, Engineering and Information Technology
VO 6
IS 4
YR 2016
SP 540
OP 543
SN 2088-5334
PB INSIGHT - Indonesian Society for Knowledge and Human Development
K1 reflow soldering; wettability; carbon nanotube; surface roughness
AB Wettability of Pb-free soldered surface is one of the main solderability classifications. The aim of this study is to investigate the effect of various percentages of carbon nanotube (CNT) loading (0 – 4%) on the wettability of solder paste SAC 237 and different substrates namely copper (Cu) and tin (Sn). The influence of surface roughness on the wetting behaviour was also studied. Both substrates were undergone a mechanical abrasion process by using four different grit sizes (P240 , P400, P600 and P800) before performing the reflow soldering process using a reflow oven at a temperature of 180°C for 13 minutes. The surface roughness of the substrates was characterized by using a profilometer. Meanwhile, wettability tests were performed by using the optical microscope. Both substrates have shown similar behaviour; the rougher surface gives better wettability compared to the smoother one. The wettability of SAC 237 is not significantly affected by the addition of various percentages of CNT. However, CNT loading in the solder paste has shown the different wetting behaviour for both substrates.
LK http://ijaseit.insightsociety.org/index.php?option=com_content&view=article&id=9&Itemid=1&article_id=903
DO  - 10.18517/ijaseit.6.4.903